Customization: | Available |
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Metal Coating: | Copper/Tin/Gold/Silver/HASL/OSP/Enig |
Mode of Production: | SMT and DIP |
Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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PCB Assembly Capability | |
Item | Capability |
PCB Base Material | FR-4/ High TG FR-4/ Aluminum/ Ceramic/ Copper/ Halogen Free material/ Rogers/ Arlon/ Taconic/ |
PCB Layers | 1-40 |
Copper Thickness | 1-6OZ |
Finished Board Thickness | 0.2-7.0mm |
Min Hole Size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
Surface Treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, lmmersion Silver, Hardgold, Flash gold, OSP... |
Outline Profile | Rout/ V-cut/ Bridge/ Stamp hole |
Advantages | ----Intelligent Management System, Intelligent Factory |
----Professional Surface-mounting and Through-hole soldering technology | |
----Various sizes like 1206,0805,0603 components SMT technology | |
----ICT(In Circuit Test),FCT(Functional Circuit Test) | |
----PCB Assembly With IPC,CCC,FCC,Rohs Approval | |
----High Standard SMT&Solder Assembly Line | |
----High density interconnected board placement technology capacity. | |
Quantity | Prototype & Low Volume PCB Assembly,from 1 Board to 100, or up to 1000 and customized |
Type of Assembly | SMD, Through-hole, and mixed Assembly |
Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free |
File Formate | Gerber files, Pick-N-Place file, Bill of Materials |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Testing | Flying Probe Test,X-ray Inspection AOI Test, High-Low Temperature Testing, Drop Testing, Salt Spray Testing, Vibration Testing |
Turn Time | Same day service to 15 days service |
PCB assembly process | Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing |